Technical Review on the Role of Soldering and Brazing in Conventional Mechanical Joining Processes
Abstract
Soldering and brazing are essential conventional non-fusion mechanical joining processes that rely on capillary action to introduce a lower-melting-point filler metal between solid base materials, forming strong metallurgical bonds without melting the parent metals. Defined by the American Welding Society, soldering operates below 450°C, while brazing occurs above this threshold but below the solidus of the base metals. This technical review comprehensively examines their fundamental principles, including wetting, spreading, and capillary flow, alongside key metallurgical aspects such as filler metal selection, phase interactions, intermetallic compound formation, and microstructural evolution. The study highlights critical process parameters (temperature, flux, atmosphere, heating methods), mechanical properties (shear strength, fatigue, creep, and thermal cycling resistance), and comparative performance against welding, adhesive bonding, and mechanical fastening. Soldering excels in electronics for low-heat, high-conductivity PCB assembly using lead-free SAC alloys, while brazing delivers superior high-strength, hermetic joints for aerospace, automotive, HVAC, and medical applications. Advantages include minimal distortion, excellent dissimilar material compatibility, and automation potential, though challenges involve joint clearance sensitivity, intermetallic growth, and temperature limitations. Recent advances in lead-free solders, high-temperature alloys, automation with Industry 4.0, and hybrid techniques further enhance their relevance. This review underscores the enduring importance of soldering and brazing in modern manufacturing for precision, reliability, and multi-material engineering solutions.
Keywords:
Soldering, Brazing, Mechanical joining processes, Mechanical fastening, FluxReferences
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